 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| Altera Device Package Information 672-Pin Non-Thermally Enhanced FineLine Ball-Grid Array (FBGA) All dimensions and tolerances conform to ANSI Y14.5M - 1994. Controlling dimension is in millimeters. Some devices have a chamfered corner at the A-1 ball location. M is the maximum solder ball matrix size. Package Information Description Ordering Code Reference Package Acronym Lead Material Lead Finish JEDEC Outline JEDEC Option Weight Moisture Sensitivity Level F FBGA Tin-lead alloy (63/37) N/A MS-034 AAL-1 3.0 g Printed on moisture barrier bag Package Outline Figure Reference Specification Symbol Min. A Millimeters Nom. - - - 27.00 BSC 0.50 0.60 1.00 BSC 26 0.70 Max. 3.50 - 3.00 - 0.30 0.25 A1 A2 D/E b e M Maximum Lead Coplanarity 0.008 inches (0.20 mm) Altera's thickness specification for A is 2.6 mm maximum. The Max item for A in the table reflects the JEDEC specification. 110 Altera Corporation Copyright (c) 2002 Altera Corp. Altera Device Package Information Package Outline Represents A1 Ball Pad Corner D 26 25 24 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF 23 22 21 20 19 18 17 16 15 13 11 9 7 5 3 1 14 12 10 8 6 4 2 Indicates location of Ball A1 E e b A2 A A1 C Seating Plane Altera Corporation 111 Copyright (c) 2002 Altera Corp. |
Price & Availability of EP1S20F672C7
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |